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Microgate Technology Secures New Invention Patent, Advancing RF Inductor Materials Innovation

Release Date:2026-04-30 02:18:00

Recently,  National Intellectual Property Administration officially published the grant announcement for an invention patent independently developed by Shenzhen Microgate Technology Co., Ltd. The patent, titled 'A Method for Preparing Powder Material for RF Inductors' was officially granted on April 24, 2026.

Filed on February 17, 2023, the patent was developed by Microgate's R&D team, including Hu Geng, Geng Zhenwei, and Mei Tao. Its successful authorization after a rigorous examination process marks another step forward in Microgate Technology's  innovation capabilities and intellectual property portfolio in core RF inductor materials.

Patent Highlights

This patent focuses on key material technology for RF inductors. It addresses a major industry challenge in high-frequency applications: achieving a better balance of high saturation, high permeability, and low loss in inductor materials.

The core process advantages include:

Classified particle-size screening and differentiated pretreatment of alloy-based raw powders and ferrite-based raw powders;

Insulation coating and annealing treatment for alloy powders, as well as pre-sintering, crushing, and cryogenic treatment for ferrite powders, helping improve insulation performance and magnetic stability;

Composite mixing, bonding, and granulation of the two powder systems to form RF-inductor powder materials with a uniform structure and strong overall performance;

Finished powder materials that deliver high saturation magnetic flux, high permeability, and low loss under RF conditions, while significantly improving insulation performance and inductor reliability.

This technology can be widely applied in high-end electronic component applications such as mobile communications, RF front-end modules, and high-frequency power supplies. It also provides critical material support for the continued development of Microgate's core products, including molded inductors and RF devices.

Continuous Innovation

Founded in 2001 and listed on the Shenzhen Stock Exchange in 2012, Microgate Technology is a leading electronic components manufacturer in China. The company focuses on the R&D, design, manufacturing, and sales of electronic components and LCM display modules, with technology innovation serving as a key driver of industrial upgrading.

In recent years, Microgate has continued to strengthen its R&D efforts in RF materials, power inductors, LTCC filters, integrated devices, and other key technology areas, building a dense and expanding patent portfolio. Recently disclosed patents include technologies related to copper-iron co-fired inductor materials, non-coupled four-phase inductors, nitride-insulated soft magnetic powders, and high-permeability, low-loss powder materials. Together, these achievements cover innovation across materials, structures, and manufacturing processes, providing strong support for Microgate's product strategy focused on higher performance, greater integration, and further miniaturization.

In 2025, Microgate delivered stable business performance, with both revenue and net profit ranking among the industry's leading players. The coordinated development of its two core businesses, electronic components and LCM display modules, continues to provide a solid foundation for sustained investment in technology R&D.

Outlook

The successful authorization of this RF inductor powder material patent further strengthens Microgate Technology's technical position in high-end passive components and RF materials.

Looking ahead, Microgate will continue to increase investment in R&D and accelerate the commercialization of high-value patented technologies. By continuously improving product performance and core competitiveness, the company aims to deliver higher-quality component solutions for customers in 5G/6G communications, automotive electronics, industrial power supplies, and other advanced application fields.


Microgate will also continue to support the high-quality development of  electronic information industry through ongoing innovation in materials, processes, and component technologies.