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Description

FEATURES

Mnolithic construction yields high reliability

High self-resonant frequency

Excellent solderability and heat resistance for either flow or reflow soldering

APPLICATIONS

High frequency circuits of telecommunication. 

Mobile phones such as GSM, CDMA, PDC, etc. 

"Bluetooth"

Other High frequency circuits in general 

Product Identification

  MGCI     1608      H       10N        J        T     -     LF
①          ②          ③      ④      ⑤      ⑥           ⑦
① Series name
② Dimension L×W:【1608: 1.6mm×0.8mm】
③Material code
④Inductance电:【3N3=3.3 nH     10N=10 nH      R10=100 nH】
⑤Tolerance of Inductance:【S:±0.3nH  D:±0.5nH   J: ±5%   K: ±10%】
⑥Packing Style:【 T: Taping     B: Bulk】
⑦ Lead free products

APPLIGATIONS 应用

High frequency circuits of telecommunication.  通讯产品的射频模块

Mobile phones such as GSM, CDMA, PDC, etc.  GSM、CDMA、PDC手机

"Bluetooth" 蓝牙模块

Other High frequency circuits in general  其它高频线路应用中

Product Identification 产品标识

MGCI     1608      H       10N        J        T     -     LF

  ①           ②        ③        ④         ⑤       ⑥          ⑦

Series name系列名称

② Dimension产品尺寸 L×W:【1608: 1.6mm×0.8mm

③ Material code材料代码

Inductance电感量:【3N3=3.3 nH     10N=10 nH      R10=100 nH】

⑤Tolerance of Inductance电感量公差:【S:±0.3nH  D:±0.5nH   J: ±5%   K: ±10%】

Packing Style:【 T: Taping编带盘装     B: Bulk散装】

Lead free products无铅产品

 

        

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 


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